Receiver architecture
Sirf StarIII GSC3f/LP chipset
20-channel, 200 000 effective correlators, L1 1575.42 MHz
C/A code (1.023 MHz chip rate)
code-plus-carrier tracking (carrier-aided tracking)
velocity, up to 500 m/s
acceleration, up to 5 G
Tracking capability
20 satellites simultaneously
Accuracy
horizontal accuracy: better than 2.2 m (CEP), 5.5 m (2 dRMS)
PPS accuracy: typically better than 1 µs
Acquisition/reacquisition performance
@ -125 dBm
- hot start TTFF: <1s (90%), 500 ms (typ) valid almanac, time, position and ephemeris
- warm start TTFF: 38 s (90%), 32 s (typ) valid almanac, time and position
- cold start TTFF: 42 s (90%), 34 s (typ) valid almanac
@ -140 dBm
- hot start TTFF: <1s (90%), <1s (typ) valid almanac, time, position and ephemeris
- warm start TTFF: 59 s (90%), 49 s (typ) valid almanac, time and position
- cold start TTFF: 66 s (95%), 52 s (typ) valid almanac
Antenna input
integral LNA for use with passive antenna
active antenna powered through receiver (50 mA max at 12 VDC max)
Datums
supports selection of datums, default: WGS-84
Environmental
operating temperature: –40°C to +85°C
humidity: up to 95% non-condensing
altitude: –305 m to 18 000 m
Compliance
EMC: FCC - Part 15, class B
EN: 55022, class B
Physical
dimensions: 17.0 x 15.0 x 2.7 mm
weight: 2 g max
On-board filtering
L1 –75 MHz, –30 dB
L1 +50 MHz, –20 dB
Data interfaces
- two serial ports available
- CMOS-level (3.3 VDC)
- selectable baud rates
- selected NMEA-0183/SiRF binary messages: latitude, longitude, elevation, velocity, heading, time, satellite tracking status, command/control messages
- SiRF binary interface: raw data
Electrical
input power range: 3.0 to 3.6 VDC
battery backup current: 5 to 6 µA (typ) for 1.9 to 3.3 VDC (SRAM and RTC)
Power consumption
- average sustained power (after 1st solution) <117 mW at 3 V, <136 mW @ 3.3 V
- average sustained acquisition power (before 1st solution) <132 mW at 3 V, <149 mW at 3.3 V
- average initial acquisition power (1.5–2 s) <168 mW at 3 V, <189 mW at 3.3 V
Connectors
data/power: RF through surface mount pads